Kovar Housing, Microelectronic Package

• Material: Kovar
• Application: Fiber Laser
• Character: High Temperature Resistance
• Species: Housing
• Production Process: Welding
• Shape: Rectangular
• Interface Type: AC/DC
• Brand: Gaoke
• Sealing Material: Kovar, Stainless Steel,
• MOQ: 100
• Surface: Gold Plating
• Plating Thickness: 0.1~2.54μm
• Transport Package: Carton
• Specification: stainless steel, glass to metal seal
• Origin: China
• HS Code: 85419000
• Production Capacity: 1000000

Product Description

Kovar housing, microelectronic package 

Product Description

Product Application: Defense, Aviation, Aerospace, Industrial, Medical electronics
Advantages
Custom design for the microelectronic package
Variety material suitable for many working environments
Good quality and plating makes the packages suitable for high temperature

Main performance parameters:
Housing material: Kovar, Tungsten Copper, OFHC, Stainless steel
Lead material: KOVAR
Glass: 7052 or equivalent
Applicable technology for sealing: parallel sealing welding, laser welding, vacuum welding
The electric voltage: 1000 v (50 HZ)
Resistance to pressure: 40 mpa, 1 h
Insulation resistance: >20MΩ at 500VDC
Nickel layer thickness: 3~12μm
Thickness of gold layer: 0.3~3.8μm
Leakage: ≤ 1 x10^-8  atm cc/sec
Salt spray test: 5%, 24-h moisture resistance, mold resistance performance in accordance with GIB 598A-96 standard

Detailed Photos

Packaging & Shipping

FAQ

Q: Are you manufacturer or trading company?       
 A: We are manufacturer which focuses hermetic sealed package since 1976.
 

Q: What is the production capacity?
A: 1500000pcs ~ 2200000pcs per year .

Q: What is the lead time of your product? 
A: Stocks are available for some products. 20~30working days for custom parts

Q: Do you provide customized products?
A: Yes. We provide OEM and ODM service.