Singlemode Fiber Pigtail with Butterfly Dfb Laser

• Type: Cold Stamping
• Processing Type: Deep Drawing
• Material: Kovar
• Mould: Simple Single Process Dies
• Surface Processing: Electroplating
• Fine Blanking: Open
• Process: Forming Process
• Industry: Stamping Material
• Tolerances: 0.1mm
• Customized: Customized
• Species: Photoelectric Communication
• Transport Package: Carton
• Specification: Customized
• Trademark: Botou Hi-tech
• Origin: China
• HS Code: 1309961922
• Production Capacity: 100000pieces/Year

Product Description

Detailed Photos

 

Product Description

 

Model NO.	Butterfly package	Size	as Per Requirment
Sample	Support	Tolerance	as Per Requiremet
Type	Electronic Packages	Surface	Bright
Sealing Materials	Kovar	Specification	customizable
Transport Package	Case	Transport	by sea or air

Company Profile

Congratulations on finding the valuable resource Botou Hi-Tech Electronic Accessories Co., Ltd.

Established in 1980, we are the professional manufacturer of hermetic packages, as well as electronic component housings, glass to metal seal, precision stamping parts and hybrid packaging solutions etc... Our products are vital to many applications in semiconductor, medical technology, energy, defense and aerospace industries.

To best serve our customer s requirements, Botou Hi-Tech Group is committed to providing the most comprehensive and flexible manufacturing capabilities,such as stamping equipment, CNC machining center, glass to metal seal equipment, plasma cutting, packaging equipment, surface plating equipment,other surface treatment equipment, and testing laboratory equipment etc.
 

Packaging & Shipping

FAQ

 

Optoelectronic packages

 

 

Each packaging solution is developed based on our expertise and extensive model,opto-electronic devices have found their way into various applications such as high-speed telecommunication networks, data center interconnection, gas sensing, thermal imaging, IR imaging systems and medical devices.

RF&Microwave packages

 

 

Manufactures a variety of machined Kovar packages for microwave applications. Machined Kovar Packages for RF Microwave applications.They are used in aerospace, satellite communications, commercial wireless and medical instrumentation industries.

Microelectronics packages

 

 

Leading supplier of microelectronic packages in China,offer many open tool packages for the applications that require protection from various environmental conditions.Also refer to hybrid packages, multi-chip module housings, or IC packages.