Material: | Kovar |
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Type: | DIP |
Sealing Material: | Kovar, Stainless Steel, |
MOQ: | 100 |
Surface: | Gold Plating |
Plating Thickness: | 0.1~2.54um |
Samples: |
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Customization: |
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-Product Application:
Semiconductor industry, industry, medical industry, optical communication module, microwave communication
-Main performance parameters:
Eyelet material: KOVAR,SPCC,CRS,copper, tinplate, nickel-silver, aluminum, mu-metal, Cu-W etc.
Lead material: KOVAR
Glass: 7052 or other equal
Nickel layer thickness: 3 -12microns
Thickness of gold layer: 0.3-3.8 micron
Lead welding: solder bonding,Silver brazing
Applicable technology for sealing: parallel sealing welding, laser welding, vacuum welding
Operating temperature: -55 ~120
The electric voltage: 1000 v (50 HZ)
Resistance to pressure: @20ºC:40BAR/870.2 PSIG
Insulation resistance: 5000 m Ω
Hermetic: assembly to be leak tight to 1X10E-8 ATM cc/sec HELIUM
Salt spray test: 5%, 12-h moisture resistance, mold resistance performance in accordance with gjb598a-96 standard
Q: Are you manufacturer or trading company?
A: We are manufacturer which focuses hermetic sealed package since 1976.
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