Customization: | Available |
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After-sales Service: | Support |
Warranty: | 3 Months |
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Custom OEM Copper Silver/Tinplate EMI/RF Shielding Case Cover Frame Can For PCB By Precision Progress Stamping
Product Name | EMI shielding lid | Customized | Support |
Size | Customized | Nickel Layer Thickness | 3-7μm |
Thickness | According to the drawing | Gold Layer Thickness | 0.1-1.7μm |
Type | Tinplate | Stainless Steel | Copper-Nickel-Zinc |
Advantages | 1) Low price
2) Easy to solder with tin
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1) Cheaper than Copper-nickel-zinc
2) Bright surface, not easy to oxidize and rust
3) High strength
4) Good shielding effect
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1) Bright surface, not easy to oxidize and rust
2) Excellent shielding effect
3) Easy to solder with tin
4) Good corrosion resistance
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*TO Headers *CNC housing *Sensor tube *Connectors *Case&lid *Mumetal Can
Packing method
Paper | Plastic bag | Tray | Carton | Woven bag |
DHL/UPS/TNT/FEDEX | AIR | SEA | TRUCK |
Established in 1980
Professional manufacturer of hermetic packages
Congratulations on finding the valuable resource Botou Hi-Tech Electronic Accessories Co., Ltd.
Established in 1980, we are the professional manufacturer of hermetic packages, as well as electronic component housings, glass to metal seal, precision stamping parts and hybrid packaging solutions etc... Our products are vital to many applications in semiconductor, medical technology, energy, defense and aerospace industries.
To best serve our customer s requirements, Botou Hi-Tech Group is committed to providing the most comprehensive and flexible manufacturing capabilities,such as stamping equipment, CNC machining center, glass to metal seal equipment, plasma cutting, packaging equipment, surface plating equipment,other surface treatment equipment, and testing laboratory equipment etc.